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Subject:	Re: Masking Vias
From:	"d. terstegge" <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 10 Apr 2001 17:52:52 +0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (43 lines)

Hi Jerry,

I prefer the via's to be closed on both sides, or open on both sides.
When only one side has soldermask you could see some problems from the HASL process, because the solder (and fluxes, and cleaning agents) can't flow very well through these holes. Not a good way to achieve a smooth and clean solder coating in these via's.

Kind regards,

Daan Terstegge
SMT Centre
Thales Communications
Unclassified mail
Personal Website: http://www.smtinfo.net
>>> Jerry Mosur <[log in to unmask]> 04/10 4:03 pm >>>
Hello,

Have anyone specified via solder mask on top and not on bottom? I am trying
to fill-in vias as much as I can. What pitfalls in term of assembly,
reliability, etc.. I can expect?

Thanks,

Jerry

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