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April 2001

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Subject:
From:
Shawn Murphy <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 10 Apr 2001 07:42:13 -0700
Content-Type:
text/plain
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text/plain (60 lines)
In the case of vias being used at test point such as with a BGA's we have
specified that the vias be covered or pluged on the topside and left open on
the bottomside.  If you plug the topside of the via solder will not fill the
hole as you need positive pressure to move solder through a PTH or VIA in
this case.


Best regards

Shawn  C. Murphy
Process Engineer

6640 185th Ave NE
Redmond, WA 98052-5038
[log in to unmask]
Tel: (425) 885-0107 Ext. 678
Fax: (425)867-5600


 -----Original Message-----
From:   Jerry Mosur [mailto:[log in to unmask]]
Sent:   Tuesday, April 10, 2001 7:03 AM
To:     [log in to unmask]
Subject:        [TN] Masking Vias

Hello,

Have anyone specified via solder mask on top and not on bottom? I am trying
to fill-in vias as much as I can. What pitfalls in term of assembly,
reliability, etc.. I can expect?

Thanks,

Jerry

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