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April 2001

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Subject:
From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 9 Apr 2001 15:31:58 +0200
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Werner, how was your chilly nights on the road? From your 'help' mayday I took your saying litterally. Saw you alone in the big van under stars with antenna up and you lying on wolf skins with a Budweiser at left, the mouse on right side and the laptop on the, on the..on her stomach..and TN on the LCD.

As for exotic backtreating, it's IRC that makes these high power FETs. I have not got answer from them yet, they just say it is a std finish. I have got mails from Mike Fenner, Joyce Koonse and former arbiter elegantum Paul Klasek, all frighten me with all sorts of intermezzos that can happen when soldering on silver over nickel. Paul referred to a cooperation he had with you years ago, and you then came to the conclusion that Silver in most forms not good in joints. I mean metallurgicly spoken.

To tarnish or not to tarnish, that's the question
Ingemar

-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: den 6 april 2001 13:44
To: [log in to unmask]; [log in to unmask]
Subject: Re: [TN] AuSn soldering on Silver


Hi Ingemar,
Actually, should have no trouble finding the dissolution rate of Ag in Sn in
Klein-Wassink; if I recall correctly it is even faster than Au. I have no
idea whether this holds for 80AuSn, but it is not likely that you will be
soldering to Ag. In 1982, TI Ag-plated PLCC J-leads with Ag--these components
fell off the PCBs at IBM-Austin with bed-of-nails board bending. so Ag-based
IMCs are at least as brittle and weak as Au-based IMCs.
This Ag-plating problem was the reason for the formation of the IEEE
Compliant
Leads Task Force, chaired by Jack Balde, and you can find some papers on our
work in the 1983-89 time frame.
You sure have your troubles--who is coming up with all these exotic
metallizations?
Good luck.

Werner Engelmaier

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