Stannum
Mike
----- Original Message -----
From: "Ingemar Hernefjord (EMW)" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Tuesday, April 24, 2001 7:31 AM
Subject: Re: [TN] Embrittlement
> another one falling into #2 is me. Gold is Aurorum, Silver is
Argentum, Lead is Plumbum, but what was Sn? Was it Senilium? /Ingemar
>
> -----Original Message-----
> From: Wenger, George M (George) [mailto:[log in to unmask]]
> Sent: den 23 april 2001 19:46
> To: [log in to unmask]
> Subject: Re: [TN] Embrittlement
>
>
> Bev,
> It's only a tough question if 1). You didn't have a metallurgy
course or 2).
> you start to get old and forgetful. I didn't take #1 but I know a
lot about
> #2. I think Dave, like the rest of us, is starting to fall into #2.
>
> I think he meant to tell you AuSn4 and AgSn3 not Au4Sn and Ag3Sn
>
> Regards,
> George
> George M. Wenger, DMTS Bell Laboratories Princeton
> Supply Network Solutions
> PO Box 900, Princeton NJ 08542-0900
> Route 569 Carter Rd., Hopewell, NJ 08525
> (609)-639-2769 (Office), 3210 (Lab), 2346 (Fax)
> [log in to unmask]
>
>
> -----Original Message-----
> From: David Hillman [mailto:[log in to unmask]]
> Sent: Monday, April 23, 2001 12:54 PM
> To: [log in to unmask]
> Subject: Re: [TN] Embrittlement
>
>
> Hi Bev! There is a fairly large set of industry data on the solder
joint
> reliability problems induced by Gold/Tin intermetallic (Au4Sn)
formation
> and a smaller data set on the solder joint reliability problems
induced by
> Silver/Tin intermetallic (Ag3Sn) formation. See Klein Wassink's
book ISBN
> 0-901150-24-X. I would expect that if you have both intermetallic
species
> in a solder joint it just would not be a "good" thing. The use
environment
> of the assembly would also play a role in just "how much"
intermetallic
> degradation would be allowable. Tough question - good luck.
>
> Dave Hillman
> Rockwell Collins
> [log in to unmask]
>
>
>
>
> Bev Christian <[log in to unmask]>@IPC.ORG> on 04/16/2001 08:33:58
AM
>
> Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
respond
> to Bev Christian <[log in to unmask]>
>
> Sent by: TechNet <[log in to unmask]>
>
>
> To: [log in to unmask]
> cc:
>
> Subject: [TN] Embrittlement
>
>
> Good morning!
> Here is a met. question to start off the day.
>
> We know that if we have over 4% gold in a 63/37 tin lead solder
joint we
> risk gold induced embrittlement because of the production of a
significant
> amount of the tin/gold intermetallic. It is also common practise to
use a
> slight variation of the eutectic solder with a 62/36/2 Sn/Pb/Ag
> composition.
> We also know that gold and silver are 100% soluble in each other.
My
> question: if the final tin/lead based solder joint composition has a
> COMBINED noble metal percentage in the 4% range how bad is that for
solder
> joint reliability?
>
> regards,
> Bev Christian
> Research in Motion
>
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