From: Paul M Fly

Ioan,

We routinely use a flood connection on our vias, it has not caused us any
problems. The thermal
relief is required only if the hole is intended for the lead of a
through-hole component. If you are
talking about vias such as those used to connect a SMT decoupling cap to
power and/or ground
then the flood connection to the plane should not cause any problems for
you.

************************************
          Paul Fly

Eastman Kodak Company
Engineering Technology Center - PEDT
2nd Fl.  Bld. 205  K.P.
2400 Mt. Read Blvd.
Rochester, New York 14650-3007
Phone: (716) 726-5670
Fax: (716) 726-0275
E-mail: [log in to unmask]
************************************





"Tempea, Ioan" <[log in to unmask]> on 04/30/2001 09:34:01 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to "Tempea, Ioan" <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Paul M Fly/243609/EKC)
Subject:  [TN] Connection of vias to planes




Hi technos,

once again I need to come to the wisdom fountain.
Please give me some input on the issue raised by our design group that
reads:

"I would like to know if we connect all the vias connected to plane (power
or ground) without thermal connection but with flood connection, if it can
cause any assembly problems (Thermal, stress, etc...). To help to reduce
the
inductance of the vias we would like to connect these vias without thermal
connection".

Thank you,
Ioan

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