Good morning!
Here is a met. question to start off the day.
We know that if we have over 4% gold in a 63/37 tin lead solder joint we
risk gold induced embrittlement because of the production of a significant
amount of the tin/gold intermetallic. It is also common practise to use a
slight variation of the eutectic solder with a 62/36/2 Sn/Pb/Ag composition.
We also know that gold and silver are 100% soluble in each other. My
question: if the final tin/lead based solder joint composition has a
COMBINED noble metal percentage in the 4% range how bad is that for solder
joint reliability?
regards,
Bev Christian
Research in Motion
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