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Reply To: | TechNet E-Mail Forum. |
Date: | Sat, 14 Apr 2001 00:16:49 EDT |
Content-Type: | text/plain |
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Hi TechNetters,
I need your help once again [thanks to all on the MP of steel--it was exactly
what I needed]; this time I need a text book that explains the difference in
solder behavior due to creep and its property changes [like modulus decrease]
due to temperature increases in good layman's terms. I am thinking of
Klein-Wassink, Lea, Frear, Lau ed. (Solder Joint Reliability).
Werner Engelmaier
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