What is the accepted method on assembled boards for dealing with
non-solderable features such as exposed via pads/holes when the final
surface finish is White Tin or Immersion Silver. This assumes no wave solder
is required at assembly. Is the original surface finish adequate? Do you
screen solderpaste on the vias as is the case with OSP finishes?
Thanks
Mike Bailey
Director of Engineering
TTM Technologies
2630 S. Harbor Blvd.
Santa Ana, CA 92704
Phone(714) 241-0303
FAX (714) 241-0708
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