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Fri, 20 Apr 2001 07:52:46 +0200 |
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Hello to all of you,
Currently,we are designing a double sided reflow board.
All our assembled boards have to pass electrical test, preferably on a bed of nails.
Is it good practice to close all through hole testvias by paste screening in order to create good
vacuum conditions when testing ?
So, I want to include these vias in the paste screen artwork. What is a good diameter in the paste
screen for closing vias with a finished hole diameter of 8 mil ?
Is there not a risk that the solder paste will flow through the via holes and causing shorts at the other side
during the second step of reflowing ? The board has a thickness of 95 mil.
Anyone has some experience in this matter ?
Thanks in advance.
Cor Coolen
Board Designer
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