Woked at HP and minimum was, two years ago, 25 mils. Currently working at
another large manufacturer with similar DFM study capabilities and data
allowing no less than 20 mil spacing when I was just getting used to 50.
Blows me away how this all works, and under what conditions as orientation,
process capabilities, soldering requirements, etc.. Hell, how do you
determine whether 15 mils works - do the experiment, over the next 12
months, and let us all know.

Honestly, I'm with you. Push the envelope as far as you can and someone
responds with a way to accomodate your "requirements." Great world we're
living in unless you're snowed in in MA. Snow's no big deal as long as I can
figure out glue dot size, placement accuracy, and compatible, with solder
joint, cure cycles.

Earl

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