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Subject:	Re: wafer question
From:	Hann Pang <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 1 Mar 2001 10:15:50 -0600
Content-Type:	text/plain
Parts/Attachments:	text/plain (57 lines)

hi Ingemar,

I'm interested to hear about this too.  adhesive to backside is for die
attach?  if so, wont it cause problems when singulating?

Hann





"Ingemar Hernefjord (EMW)" <[log in to unmask]> on
03/01/2001 08:58:48 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to "Ingemar Hernefjord (EMW)" <[log in to unmask]>


To:   [log in to unmask]
cc:    (bcc: Hann Pang/US-Corporate/3M/US)
Subject:  [TN] wafer question



Hi,
was speaking with someone here a year ago about applying adhesives directly
on wafer backsides. Who were You?  Not many asking such questions and I
have lost this person's last mails. I remember that guy got few or no
answers at all  here.
Ingemar Hernefjord
Ericsson Microwave Systems

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