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Subject:	Re: Al wire bonding
From:	Ken Mc Gowan <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Mon, 5 Mar 2001 13:40:43 -0200
Content-Type:	text/plain
Parts/Attachments:	text/plain (54 lines)

Hi There,

Do you have any local metal finisher that could sulphuric anodise ro ca 20
micron and leave unsealed. Boric anodising is even better but rare. This is
how they get wings to stay on the Eurofighter. (not a military secret I
hope).

Best Regards,

Ken McGowan
----- Original Message -----
From: "J. M. Badia" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, March 05, 2001 10:41 AM
Subject: [TN] Al wire bonding


I'm unable to make a wire ultrasonic bonding (wedge bond) with Al wire
directly to cupper pad.
With your permission, I'd be interested to known if this bonding is possible

Thanks in advanced


Josep M. Badia
Servei de Recursos Tècnics
Tèlf/Fax: 977 559630/559605
Univ. Rovira i Virgili

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