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March 2001

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Subject:
From:
"Misner, Bruce" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 5 Mar 2001 07:31:14 -0600
Content-Type:
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text/plain (57 lines)
Josep,

Bonding Al wire directly to Copper won't work. Try plating over the Copper
with electroless Nickel (about 100 u inches) followed by electroless Au
(about 5-10 u inches).  This surface would then be solderable AND Al wire
bondable.

Regards,
Bruce Misner

> ----------
> From:         J. M. Badia[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;J. M. Badia
> Sent:         Monday, March 05, 2001 7:41 AM
> To:   [log in to unmask]
> Subject:      [TN] Al wire bonding
>
> I'm unable to make a wire ultrasonic bonding (wedge bond) with Al wire
> directly to cupper pad.
> With your permission, I'd be interested to known if this bonding is
> possible
>
> Thanks in advanced
>
>
> Josep M. Badia
> Servei de Recursos Tècnics
> Tèlf/Fax: 977 559630/559605
> Univ. Rovira i Virgili
>
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