Hi Earl-

No experience with them, but there are some new dispensers out that are
capable of placing a dot on top of a dot, "shooting" it into position- the
mfg name escapes me.

In theory, this should take up less room under the part, but still doesn't
address the root of the problem- reflowing paste and curing glue at the same
time- the respective needs are too different and leads to the glue/paste
problems we all know and love.

If you could combine the new dispenser with a glue that cures at a temp
closer to reflow, bingo.  Screen printing paste should work well too, but
can be a pain if you don't have a spare printer sitting around.

Here's hoping & good luck-

Bill C

-----Original Message-----
From: Earl Moon [mailto:[log in to unmask]]
Sent: Thursday, March 01, 2001 6:25 PM
To: [log in to unmask]
Subject: Re: [TN] RFU2


Steve.

I'll try anything and have done most but I still keep seeing epoxy in solder
joints because of tight spacing and lack of registration. How small a glue
dot can be printed/dispensed and registered without encroaching on SMT
pad/solder joint, etc.? I still have x-section nightmares bouncing around.


Thanks,

Earl

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