Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 29 Mar 2001 16:30:30 +0800 |
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No, but I'ld love to hear more!
Pete Duncan
DUTTON Phil
<phil.dutton@ To: [log in to unmask]
TENIX.COM> cc:
Sent by: Subject: [TN] Oval BGA Pads
TechNet
<[log in to unmask]
ORG>
03/29/01
02:39 PM
Please
respond to
"TechNet
E-Mail
Forum.";
Please
respond to
DUTTON Phil
Hello TechNetters,
Has anyone come across the practice of using oval (elongated) pads for BGAs
to help the X-ray inspection of the solder joints?
The claim is that, in a vertical view, you can then see past the ball and
examine the solder fillet on the elongated section of the pad.
regards,
Phil.
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