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Subject:	Oval BGA Pads
From:	DUTTON Phil <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Thu, 29 Mar 2001 16:39:54 +1000
Content-Type:	text/plain
Parts/Attachments:	text/plain (21 lines)

Hello TechNetters,

Has anyone come across the practice of using oval (elongated) pads for BGAs
to help the X-ray inspection of the solder joints?
The claim is that, in a vertical view, you can then see past the ball and
examine the solder fillet on the elongated section of the pad.

regards,

Phil.

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