Hi Technetters,
I've seen several discussions in the archives
regarding via tenting/plugging but it seems to me that
neither addressed my exact situation

We have boards containing 0.040", 0.050" pitch BGAs
that are supposed to be HASL finished.
At first we designed the via tenting around the BGA
only from the component side (single sided) and the
tenting failed.
This time we have tested double sided tenting and it
held very well through HASL and SMD assembly (the
boards won't be processed through wave).

My question is: Should I specify the via tenting
aroung the BGA to be double sided from no on (I don't
seem to have any other choic)? What are the pros and
cons (assuming I do not want to respecify  an
alternative finish - OSP, ENIG, etc).
We do not use No-Clean flux.
The products are High-reliability type boards. Raw
material - polyimide, thickness - ~2.0mm

Best regards,
Ervin


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