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March 2001

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Subject:
From:
Michael McInerney <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 28 Mar 2001 08:21:57 -0500
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Hi

We are planning to develop a small research area in microelectronic
packaging.  This idea is just at the preliminary planning stage and we
would like suggestions as to the type of equipment that we will need.
The people on this list are very active in packaging and package
attachment so I thought that asking you would be a good way to start.

Michael


Michael McInerney
Physics and Applied Optics
Rose-Hulman, Terre Haute, Indiana

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