Tamir,

We, you have a problem especially if the board is more than just a "simple"
backplane. The 13:1 will kill you if the MLB construction doesn't
notwithstanding hole to pad registration and annular ring.

Haven't really looked at materials but all single ply 2113 preg and core
might get you close if you use .5 oz. Cu throughout and have no serious
impedance requirements.

Hole plating near impossible to reach thickness and ductility requirements
needed to keep hole walls from coming apart - but you already know that.

I'm currently using Hadco/Sanmina, in that order of technical excellence,
for some 20 layer stuff. Excellent working with Haverhill, MA tech center.
Start talking with Mike Mikucki and Ara and Bruce. They know lots of
stuff. Tyco also excellent.

Have worked with IBM on higher layer count boards with great success.
However, these folks get real serious about managing the whole program.


Enjoy,

Earl Moon

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