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March 2001

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Subject:
From:
"<Peter George Duncan>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 27 Mar 2001 09:39:54 +0800
Content-Type:
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text/plain (64 lines)
Very poor, as it won't wet or flow much or at all, so any joint formed will
be physically weak.

Can I ask why a fair child like yourself wants to do this?

Rgds

Pete Duncan
Asst Principal Engineer
ST Aerospace





Jonathan A Noquil <[log in to unmask]>@IPC.ORG> on
03/27/2001 09:10:31 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to [log in to unmask]

Sent by:  TechNet <[log in to unmask]>


To:   [log in to unmask]
cc:
Subject:  [TN] Reliability of Solders




Hi Techies
I would like to know what reliability would i expect
if soldering a component using a solder alloy
not melting it to its liquidus or over its liquidus temperature.
Any experience on this?

Thanks and more power.

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