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March 2001

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Subject:
From:
Mike Fenner <[log in to unmask]>
Reply To:
Mike Fenner <[log in to unmask]>
Date:
Mon, 26 Mar 2001 21:20:41 +0100
Content-Type:
text/plain
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text/plain (106 lines)
At this size I imagine weight would also be a concern.

Mike

----- Original Message -----
From: "Kasprzak, Bill (sys) USX" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Monday, March 26, 2001 1:25 PM
Subject: Re: [TN] HUGE SMT assembly...


> Guys,
>
> I'm really impressed by this 52, 42, and 60 layer discussion. I'm
curious
> though, are these boards like, .250" thick? Are they thicker? Do you
have
> any thru hole parts? Can you wave solder these puppies?
>
> Thanks.
>
> Bill Kasprzak
> Moog Inc.
>
> > -----Original Message-----
> > From: Earl Moon [SMTP:[log in to unmask]]
> > Sent: Saturday, March 24, 2001 12:48 PM
> > To:   [log in to unmask]
> > Subject:      Re: [TN] HUGE SMT assembly...
> >
> > Well, you've really done it this time. I did 52 layer stuff that
was half
> > that size and 42 layer stuff 17x21 and one 60 layer that was 24x24
but
> > through hole. Ain't it fun?
> >
> > For the 52 layer stuff, we did 1200 I/O devices as CCGA. For the
42, we
> > did
> > 3400 I/O MCM's with some interesting twists. Did them on Universal
and
> > Siemens. Mydata used at HP had the big capability for 24x24.
> >
> > Don't know why I'm discussting this but it is interesting. You
sure know
> > how
> > to have fun.
> >
> > Any tornadoes yet,
> >
> > Earl Moon
> >
>
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