Dear Ms. Carraway:
Regarding your question on cupric etch rate/profile, it has been my experience mechanical
variables (spray pressure, nozzle density, nozzle type, rate of etchant flow, spray/ocillation
pattern, distance from the nozzle to the panel, guide roller interference with spray, etc.),
have a larger inpact on etch rate than acid normality. We have recently profiled
approximately 30 cupric etchers in an attempt to correlate overall etching performance (speed
and etch factor) based upon mechanical and chemical variables; and it is likely a performance
estimation for your etcher could be made by comparing it with data gathered thus far. (Please
e-mial or call me at (763-479-6525) if you would like a copy of the profile forwarded as an
e-mial attachement.)
Regards,
Ted Stern
"Jana L. Carraway" wrote:
> Greetings IPC TechNet Forum!
>
> I am in search of information on two topics: 1)Etch rates/factors for cupric
> chloride etchant and 2) current carrying capacity of very fine lines.
>
> 1) With respect to Cupric Chloride etchant, does anyone have information
> they would be willing to share on the etch rate and etch profile? My dusty
> brain cells seem to remember that the etch rate increases with acid
> normality, but that the lateral etch increases as well. I have it in mind
> that for fine line, an acid normality of around 1.0 N produced the best etch
> factor, although affected the speed/throughput. Would anyone have a bit of
> information they could share on this?
>
> 2) My copy of the Printed Circuit Manufacturing book has current carrying
> capacity vs line width down to 0.020" lines.... I am looking for the current
> carrying capacity of 25, 50, and 75 micron lines. Could someone point me in
> the direction of this information?
>
> I greatly appreciate the help.
> Best Regards,
> Jana Carraway
>
> Jana Carraway
> Micro Systems Engineering, Inc.
> 6024 SW Jean Road
> Lake Oswego, OR 97035
> 503-635-4016
>
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