Greetings IPC TechNet Forum!

I am in search of information on two topics: 1)Etch rates/factors for cupric
chloride etchant and 2) current carrying capacity of very fine lines.

1) With respect to Cupric Chloride etchant, does anyone have information
they would be willing to share on the etch rate and etch profile?  My dusty
brain cells seem to remember that the etch rate increases with acid
normality, but that the lateral etch increases as well.  I have it in mind
that for fine line, an acid normality of around 1.0 N produced the best etch
factor, although affected the speed/throughput.  Would anyone have a bit of
information they could share on this?

2) My copy of the Printed Circuit Manufacturing book has current carrying
capacity vs line width down to 0.020" lines.... I am looking for the current
carrying capacity of 25, 50, and 75 micron lines.  Could someone point me in
the direction of this information?

I greatly appreciate the help.
Best Regards,
Jana Carraway


Jana Carraway
Micro Systems Engineering, Inc.
6024 SW Jean Road
Lake Oswego, OR  97035
503-635-4016

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