Hi Ted,
Which web site you taking about ? Appreciate you could advise.
Regards.
Ted Tontis wrote:
> Check out this web sight. This month's magazine had some good articles on
> some of the new technology.
>
> Ted T.
>
> -----Original Message-----
> From: Marsico, James [mailto:[log in to unmask]]
> Sent: Tuesday, March 13, 2001 1:04 PM
> To: [log in to unmask]
> Subject: [TN] ADVANCED PACKAGING MATERIALS AND TECHNOLOGIES
>
> Dear Technetters:
>
> This may be an unusual request, but here goes. I have an opportunity to
> work on an electronics packaging design from conception to production. The
> ground rule of this design is to use packaging, materials, processes and
> technologies which will be state-of-the-art 5 to 10 years from now.
> Everything from chassis materials, PWBs, assembly processes, component
> types, etc., to produce a product which is cost effective while maintaining
> high reliability. For me, immerging technologies include composite
> materials, high density interconnects, flip chip, flex circuits, micro vias,
> but I know these technologies are already established. What's new? I'm
> looking for a place to start. Any suggestions?
>
> Jim Marsico
> Senior Engineer
> Production Engineering
> AIL/Electronics Systems Group
> An EDO Company
> [log in to unmask] <mailto:[log in to unmask]>
>
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