Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Wed, 21 Mar 2001 08:08:34 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
hi,
i can't imagine any truly thermally conductive adhesive flowing very well. a material that you might look at is an aluminum nitride filled polysulfide. it is trabond 927-1 (ne ablebond 927-1). we've used it for years, and it works quite well. i can't speak for bga's; but when used with gullwing packages, it is repairable.
phil
-----Original Message-----
From: Alain Savard [mailto:[log in to unmask]]
Sent: Wednesday, March 21, 2001 7:13 AM
To: [log in to unmask]
Subject: [TN] Thermally conductive adhesive
Hello Oh Wise Ones, (and hello to the others TechNetters too)
We need to put some thermally conductive adhesive under a component. There
is a hole through the boards to allow some material to flow through, but the
adhesive must NOT be electrically conductive. We've tried the Output 384 by
Loctite, but it hardens too fast and doesn't flow enough.
For technical reasons, we cannot apply the adhesive before the boards is
assembled.
Any ideas would be welcome.
Thanks,
Alain Savard, B.Sc.
Chemical Process Analyst
CAE Montreal
e-mail: [log in to unmask]
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
|
|