Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 20 Mar 2001 14:09:44 -0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi all,
I have a question regarding thermal cycling, a good pcb that has passed all
pretests and post tests with a typical thermal cycle. A few PCBs were then
hit with a cold spray of -30c and then tested again, after this test a fall
out of 20%. Are we introducing a crack by the severe thermal shock of the
cold spray or is it revealing a bad solder joint.
Thanks in advance,
Bob Perkins
SMT Process Manufacturing,
Automation Technician
Aimtronics-Delta
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
|
|