Yes H,
think you are right. If using std bluetape+wobble and scribing you certainly have a nut to crack. The question is full of trouble already from beginning. That's why I'm asking if anyone out there dared. Am sure Big Blue or a Toshiba or someone of the progressive elephants have something cooking in secret labs, no meaning ask them. But film makers should be interested to sell, supposedly. My thought is that you need something that behave brittle for enhancing the scribe process, but becomes 'wet' above +100C or so. Old good AuSi eutectic scrubbing would still do if not for new SiGe, GaAs and other new discs. So, mmm, you should know if any!

Ingemar

-----Original Message-----
From: Hann Pang [mailto:[log in to unmask]]
Sent: den 1 mars 2001 17:16
To: [log in to unmask]
Subject: Re: [TN] wafer question


hi Ingemar,

I'm interested to hear about this too.  adhesive to backside is for die
attach?  if so, wont it cause problems when singulating?

Hann





"Ingemar Hernefjord (EMW)" <[log in to unmask]> on
03/01/2001 08:58:48 AM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
      to "Ingemar Hernefjord (EMW)" <[log in to unmask]>


To:   [log in to unmask]
cc:    (bcc: Hann Pang/US-Corporate/3M/US)
Subject:  [TN] wafer question



Hi,
was speaking with someone here a year ago about applying adhesives directly
on wafer backsides. Who were You?  Not many asking such questions and I
have lost this person's last mails. I remember that guy got few or no
answers at all  here.
Ingemar Hernefjord
Ericsson Microwave Systems

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