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March 2001

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Subject:
From:
"Ingemar Hernefjord (EMW)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 2 Mar 2001 08:36:37 +0100
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text/plain
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Suppose it was you, Steve.
So you leave eminent CTS, gosh, must be a disaster for them. Are you cloning now then? Thanks for points. Have searched on both company's pages but didn't find specifically that film. DuPont and mmm  have films, but they are all sort of thermoplastics which need >>300C+lots of newtons for attaching securely, and I want something far easier as you understand. Secondstitching rather. Semi makers not interested but otherwise they could spin some soup on. Adhesion is not main objective but thermal transportation capacity. So, dear Steve, if you have something in your hypothalamus that can be one or two cents, I'm glad to hear. If TN is not convinient for you any more, please send your pigeon off lime.

Ingemar


-----Original Message-----
From: Creswick [mailto:[log in to unmask]]
Sent: den 1 mars 2001 21:26
To: [log in to unmask]
Subject: Re: [TN] wafer question


Ingemar,

Was it I??

PS - I am no longer functionally employed at CTS RF Integrated Modules, but
do still read my e-mail (occasionally) here at home.  Will be officially
re-establishing myself at Gentex Corp, near the end of the month.


Ablestik made some wafer films, I think AI Technology did as well, maybe one
or two others.

Strange that you should ask, because I am currently "shaking the bushes" for
a similar product that I can use on ~0.25 um square devices!

Steven Creswick

At 03:58 PM 3/1/01 +0100, you wrote:
>Hi,
>was speaking with someone here a year ago about applying adhesives directly
on wafer backsides. Who were You?  Not many asking such questions and I have
lost this person's last mails. I remember that guy got few or no answers at
all  here.
>Ingemar Hernefjord
>Ericsson Microwave Systems
>
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