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March 2001

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Subject:
From:
"<Rudy Sedlak>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 1 Mar 2001 22:50:22 EST
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text/plain
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text/plain (18 lines)
There was a time when putting rather thick Gold, 2-3 microns, directly on
Copper, with no Nickle barrier, was common in Britain, and met the British
Telecom specs....(comment here about the quality of the telephone service in
Britain is too easy...and we are too professional, aren't we?)

Rudy Sedlak
RD Chemical

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