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March 2001

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Subject:
From:
Guenter Grossmann <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 19 Mar 2001 10:39:01 +0100
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Julien

What I heard is that rework of BGA's without bottom heating of the PCB is extremely difficult ( well some say impossible ).

Best regards



Guenter Grossmann

Swiss Federal Institute for Materials Testing and Research EMPA
Centre for Reliability
8600 Duebendorf
Switzerland

Phone: xx41 1 823 4279
Fax :      xx41 1823 4054
mail:     [log in to unmask]

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