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March 2001

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Subject:
From:
Karen Tellefsen <[log in to unmask]>
Reply To:
Karen Tellefsen <[log in to unmask]>
Date:
Thu, 1 Mar 2001 22:22:17 -0500
Content-Type:
text/plain
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The problem with putting gold over copper is that the
copper will diffuse into the gold, which is why a Ni
barrier is used for gold-plated contacts.

I have no idea how a gold flash directly over Cu
would work as a soldering finish, but it's easier to
solder on Cu than Ni.

----- Original Message -----
From: <[log in to unmask]>
To: <[log in to unmask]>
Sent: Thursday, March 01, 2001 9:58 PM
Subject: [TN] Soft Gold Over Copper


> I have been told by a customer that various folks are putting 1-3 micro
> inches of solft gold directly over copper on PCBs in place of solder for
> thru-hole applications.  Has anyone out there been trying this
successfully?
> What about oxidation issues,  leeching of gold into the wave solder pot,
> using no-clean flux with oxidized leads, etc???  Any help would be
> appreciated.  Thanks, Bill
>
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