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March 2001

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From:
IPC Forum <[log in to unmask]>
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Date:
Sun, 18 Mar 2001 17:56:09 +0800
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Hi, Ted,



Thanks for your kindly response. According to your advice, I still not very clear about (S,S,P,S,S,P,S,S correct/ S,P,P,S,S,S,S wrong).Could you help me again? By the way, could you tell me what parameter is fit for double side rigid PCB with 1 oz copper and 2116 P.P?



thks,

George 



----- Original Message ----- 

发件人: "Ted Tontis" <[log in to unmask]>

收件人: <[log in to unmask]>

发送时间: 2001年3月17日 George 00:25

主题: Re: [TN] twist and wrap issue





> George,

> 

>         The most common reason for warp and twist is tempter. If a board

> cools unevenly then the board might warp and twist. Best way to avoid this

> is to make sure that your layer stack up must be symmetrical apposed to

> asymmetrical.

> (S,S,P,S,S,P,S,S correct/ S,P,P,S,S,S,S wrong). If the edges of the board

> cool before the center has a chance too then it will warp, after lamination.

> If this is the problem then you should be able to heat the board up and cool

> it down slower and relive the problem. It can also be that there is an

> uneven amount of resin on the board.

> 

> I hope this answers you question,

> 

> Ted

> 

> -----Original Message-----

> From: Nancy Trumbull [mailto:[log in to unmask]]

> Sent: Friday, March 16, 2001 5:42 AM

> To: [log in to unmask]

> Subject: Re: [TN] twist and wrap issue

> 

> 

> Sorry George,

> What it is you what to know.

> Your question is not clear.

> Nancy T.

> 

> >>> [log in to unmask] 03/15/01 09:31PM >>>

> Hello, Everyone

> 

> Does anyone kindly help me explain the reason for wrap and twist of rigid

> PCB?

> I'm appreciate your generous guidance and your any advice.

> 

> George Chu

> Quality Dept.

> Phone: ++86 512 5651961 ext.6201

> Fax:   ++86 512 5613446

> Email: [log in to unmask]

> 

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