There are many potential problems with this type of process including
material incompatability, solder balls in the adhesive, adhesive
contamination of the pads, etc.

Having given this warning I will say I have been extremely successful with
this approach.  The resulting solder joints look fine (visually, cross
section, test, field experience -- IPC class 2,3)

Best of Luck
Brad Vanderhoof

-----Original Message-----
From: Steffen, Don E [mailto:[log in to unmask]]
Sent: Friday, March 16, 2001 7:27 AM
To: [log in to unmask]
Subject: [TN]



TECHNETTERS

I am currently trying to set up an experiment using paste printing and glue
dot dispensing to help reduce solder wave defects, I feel I have covered all
of my bases as far as stencil design, adhesive dot parameters and reflow
profile, however my problem is that I am facing a certain amount of
skepticism about creating unreliable solder joints by reflowing then wave
soldering the joints.  I was wondering if anyone out there has went through
this change and has some feedback that could help me put these fears to
rest.  This is a no-clean solder process.

Donn E Steffen
Senior Quality Engineev
VDO Control Systems
Ph# 219-920-6052
Fax# 219-925-8710
Cell# 219-417-2926
Pager# 219-430-2826



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