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March 2001

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Subject:
From:
Creswick <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 1 Mar 2001 20:03:10 -0500
Content-Type:
text/plain
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text/plain (155 lines)
Hann,

Guess that I will have to do some checking.  Haven't used it in a few years.

Basically, it is a means of applying adhesive to the device/package iterface
without having to dispense/stencil/or transfer it at each site.  By taking
one step to apply it to the wafer, you eliminate all the subsequent dispense
operations - but you must have a heated stage for attachment of the device.
Process simplification.

Steve

At 03:38 PM 3/1/01 -0600, you wrote:
>
>Steve,
>wat're the benefits of using this kind of film?   i went to abelstik's
>website and saw a temporary wafer dicing film Ablefilm.  apparently its not
>a die attach adhesive.
>
>Hann
>
>
>
>
>Creswick <[log in to unmask]> on 03/01/2001 02:33:14 PM
>
>Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
>      to Creswick <[log in to unmask]>
>
>
>To:   [log in to unmask]
>cc:    (bcc: Hann Pang/US-Corporate/3M/US)
>Subject:  Re: [TN] wafer question
>
>
>
>Hann,
>
>
>Nah!  It is B-staged, so it normally becomes a tack-free surface on the
>back-side of the wafer.  Just saw right through it.  If applied correctly,
>you do not even know it is there.  You need to place the device on a warmed
>surface, however (subject to the needs of the material you choose to use).
>Otherwise, it will essentially move at will.
>
>Steve C
>
>At 10:15 AM 3/1/01 -0600, you wrote:
>>hi Ingemar,
>>
>>I'm interested to hear about this too.  adhesive to backside is for die
>>attach?  if so, wont it cause problems when singulating?
>>
>>Hann
>>
>>
>>
>>
>>
>>"Ingemar Hernefjord (EMW)" <[log in to unmask]> on
>>03/01/2001 08:58:48 AM
>>
>>Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please
>respond
>>      to "Ingemar Hernefjord (EMW)" <[log in to unmask]>
>>
>>
>>To:   [log in to unmask]
>>cc:    (bcc: Hann Pang/US-Corporate/3M/US)
>>Subject:  [TN] wafer question
>>
>>
>>
>>Hi,
>>was speaking with someone here a year ago about applying adhesives
>directly
>>on wafer backsides. Who were You?  Not many asking such questions and I
>>have lost this person's last mails. I remember that guy got few or no
>>answers at all  here.
>>Ingemar Hernefjord
>>Ericsson Microwave Systems
>>
>>
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