Hello,

I searched through the archives, but couldn't find much in the way of
specifics (although a few good summaries of positives and negatives of the
processes). We're looking to use score and break depanelization on a new
product, and I was interested in finding out what design rules people are
using.

Our CEM tells us .040" from board edge to component body and .020" to traces
or pads when we use a "pizza cutter" type depanelization machine as this
process doesn't cause too much stress on the board. Is this consistent with
what others have used, and have the results been successful? Is this "pizza
cutter" a standard tool that assembly shops have?

What rules are used when just hand breaking the boards with a v-groove. How
about with a breakaway tab ("mouse bite")?

My main concern is not inducing any excess stress on the board or cracking
any components/joints.

Thanks for the assistance!
Matt

~~~~~
Matt Sanders - Trimble Navigation, Component Technologies
[log in to unmask] <mailto:[log in to unmask]>
Phone: 408.481.7965
Fax: 408.481.2202
Pager: 408.619.3899

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