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March 2001

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Subject:
From:
"Kelly M. Schriver" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Mar 2001 16:10:59 -0600
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Hi Jim -

You're entering an area that I spent a good portion of my professional life
in, including these early stages of retirement.  First, I would give a bit
of advice: go with a bit of caution.  Sometimes the wonderful things
published in the technical reports are not yet quite ready for PRODUCTION.
I've been involved in quite a number of items in which the material or parts
source simply couldn't reproduce what had been so wonderfully described,
once it came out of the laboratory environment.

Second, once you start to select an item/material/approach/design, etc.,
test it on some others of your peer group (including TechNet) to get a clear
direct understanding of its frailties and pitfalls.

Always remember: To engineer is human!!  We learn far more from what goes
less than perfect than from our successes, simply because we go back to
analyze what the source of the problems were.

And, lastly, always ask the question of the material or process: "IS THIS
REASONABLE", then take the time to try to understand why or why not.

Best of luck and good regards on your endeavors, and I hope you enjoy it as
much I have mine.  If I can be of assistance, please shoot me a direct
Email.

Kelly
-----Original Message-----
From: Marsico, James <[log in to unmask]>
To: [log in to unmask] <[log in to unmask]>
Date: Tuesday, March 13, 2001 1:10 PM
Subject: [TN] ADVANCED PACKAGING MATERIALS AND TECHNOLOGIES


>Dear Technetters:
>
>This may be an unusual request, but here goes.  I have an opportunity to
>work on an electronics packaging design from conception to production.  The
>ground rule of this design is to use packaging, materials, processes and
>technologies which will be state-of-the-art 5 to 10 years from now.
>Everything from chassis materials, PWBs, assembly processes, component
>types, etc., to produce a product which is cost effective while maintaining
>high reliability.  For me, immerging technologies include composite
>materials, high density interconnects, flip chip, flex circuits, micro
vias,
>but I know these technologies are already established.  What's new?  I'm
>looking for a place to start.  Any suggestions?
>
>Jim Marsico
>Senior Engineer
>Production Engineering
>AIL/Electronics Systems Group
>An EDO Company
>[log in to unmask] <mailto:[log in to unmask]>
>
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