You're right, it is DoD stuff. Do you know where I might find this
pamphlet?
Jim Marsico
Senior Engineer
Production Engineering
AIL/Electronics Systems Group
An EDO Company
[log in to unmask] <mailto:[log in to unmask]>
-----Original Message-----
From: Phil Crepeau [SMTP:[log in to unmask]]
Sent: Tuesday, March 13, 2001 3:56 PM
To: [log in to unmask]
Subject: Re: [TN] ADVANCED PACKAGING MATERIALS AND
TECHNOLOGIES
hi,
when i say this, i assume you are working on dod stuff. there is a
pamphlet published in coordination with three departments of the dod. it is
entitled, 'producibility measurement for dod contracts, or..."how i can make
what the government wants without losing my shirt'. when you are done with
your project, check it out and see how prophetic it is.
phil
-----Original Message-----
From: Marsico, James [mailto:[log in to unmask]]
Sent: Tuesday, March 13, 2001 11:04 AM
To: [log in to unmask]
Subject: [TN] ADVANCED PACKAGING MATERIALS AND TECHNOLOGIES
Dear Technetters:
This may be an unusual request, but here goes. I have an
opportunity to
work on an electronics packaging design from conception to
production. The
ground rule of this design is to use packaging, materials, processes
and
technologies which will be state-of-the-art 5 to 10 years from now.
Everything from chassis materials, PWBs, assembly processes,
component
types, etc., to produce a product which is cost effective while
maintaining
high reliability. For me, immerging technologies include composite
materials, high density interconnects, flip chip, flex circuits,
micro vias,
but I know these technologies are already established. What's new?
I'm
looking for a place to start. Any suggestions?
Jim Marsico
Senior Engineer
Production Engineering
AIL/Electronics Systems Group
An EDO Company
[log in to unmask] <mailto:[log in to unmask]>
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