TECHNET Archives

March 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"<Peter George Duncan>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 14 Mar 2001 17:27:41 +0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (23 lines)
A former colleague of mine, Alan Clark, at BAE SYSTEMS, Edinburgh,
Scotland, UK has acquired a hot bar soldering system for attaching flexis
to polyimide boards. He can probably help you with some of the issues
involved. Get back to me if you want to contact him and I'll clear it with
him first. There are QA considerations, because the shape of the finished
solder joint does not conform to acceptable standards per IPC 610 - the
joints are flattened because of the constraint of the bar. The joints do
perform well, however.

Rgds

Pete Duncan

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2