Jim,
Take a look at www.waspp.org. This is aa Army/Lockheed Martin R&D project
investigating the use of SiC coating over bare wafers to seal them. Some interesting HAST
results included. The project is 18 months old.
D. A. Douthit
"Marsico, James" wrote:
> Dear Technetters:
>
> This may be an unusual request, but here goes. I have an opportunity to
> work on an electronics packaging design from conception to production. The
> ground rule of this design is to use packaging, materials, processes and
> technologies which will be state-of-the-art 5 to 10 years from now.
> Everything from chassis materials, PWBs, assembly processes, component
> types, etc., to produce a product which is cost effective while maintaining
> high reliability. For me, immerging technologies include composite
> materials, high density interconnects, flip chip, flex circuits, micro vias,
> but I know these technologies are already established. What's new? I'm
> looking for a place to start. Any suggestions?
>
> Jim Marsico
> Senior Engineer
> Production Engineering
> AIL/Electronics Systems Group
> An EDO Company
> [log in to unmask] <mailto:[log in to unmask]>
>
> ---------------------------------------------------------------------------------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
> Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> ---------------------------------------------------------------------------------
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
