Hann,


Nah!  It is B-staged, so it normally becomes a tack-free surface on the
back-side of the wafer.  Just saw right through it.  If applied correctly,
you do not even know it is there.  You need to place the device on a warmed
surface, however (subject to the needs of the material you choose to use).
Otherwise, it will essentially move at will.

Steve C

At 10:15 AM 3/1/01 -0600, you wrote:
>hi Ingemar,
>
>I'm interested to hear about this too.  adhesive to backside is for die
>attach?  if so, wont it cause problems when singulating?
>
>Hann
>
>
>
>
>
>"Ingemar Hernefjord (EMW)" <[log in to unmask]> on
>03/01/2001 08:58:48 AM
>
>Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
>      to "Ingemar Hernefjord (EMW)" <[log in to unmask]>
>
>
>To:   [log in to unmask]
>cc:    (bcc: Hann Pang/US-Corporate/3M/US)
>Subject:  [TN] wafer question
>
>
>
>Hi,
>was speaking with someone here a year ago about applying adhesives directly
>on wafer backsides. Who were You?  Not many asking such questions and I
>have lost this person's last mails. I remember that guy got few or no
>answers at all  here.
>Ingemar Hernefjord
>Ericsson Microwave Systems
>
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