TECHNET Archives

March 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Nicolas Ortiz <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 12 Mar 2001 10:11:15 -0700
Content-Type:
text/plain
Parts/Attachments:
text/plain (18 lines)
I have a question for all you technetters. We are experiencing cracking on
certain 1812 ceramic capacitor. The cap cracks on the joint between the
ceramic and the end termination. We already checked our process, following
the vendor's recommendation, and still have between 1-2% cracked just after
the second pass oven. The component is placed in the first pass of a double
sided reflow (no wave solder). Does anybody experienced a situation like
this?

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2