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March 2001

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Subject:
From:
Michael Forrester <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 9 Mar 2001 17:27:28 -0500
Content-Type:
text/plain
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text/plain (56 lines)
Earl,

     I have included a .bmp snap shot of our layer stack-up for a 12 layer .062
bd.  I have had
the board quoted by three vendors and fabricated by another without a single
question or any resistance.

Best Regards,

Mike
----->(See attached file: Layer Stack-UP.bmp)




Earl Moon <[log in to unmask]> on 03/09/2001 02:39:06 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
      Earl Moon <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Michael Forrester/NEWYORK/LECROY)

Subject:  Re: [TN] MicroVia In Pad Vs Silver VIA fill



I'm with you guys on all that stuff. We're all doing it. My question was how
any of you gets a 12-14 layer board down to .062 thickness.

MoonMan

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