We currently have a design with  15 X 15 array BGA patterns a 12 layer 0.62 bd.
There are 10 mil vias in every BGA pad (22 mil pad) .
The reason for the Via in pad is keep the runs as short as possible.  Currently
we fill the vias with conductive silver epoxy and plate E Ni/I Au
over the entire pad surface.  I would like to try a microvia in pad, no via
fill, and OSP.  My questions are:

          1) Can I get away with not filling the microvia to prevent solder
thieving?
          2) Are there any problems with this approach?  If NG, other ideas to
get rid of silver fill?
          3) Is there any disadvantage/reliability risk, to using silver via
fill other than cost and longer lead time?

     Thank you in advance.

Best Regards,

Michael Forrester

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