TECHNET Archives

March 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"<Rudy Sedlak>" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 26 Mar 2001 15:32:24 EST
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines)
Ted Stern is correct in what he says, that mechanical aspects play a huge
part in determining etch rates, and etch factors, but chemistry plays a big
part of it as well.

A major resource for specifics in this area is Don Ball of Atotech, in State
College PA, who has probably done more well tuned research into these
questions than anybody.  I respect Don's reseach a lot, because he has not
axe to grind, and nothing to promote, he is simply doing it for technical
service for his customers.

Good luck,

Rudy Sedlak
RD Chemical Company

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2