TECHNET Archives

March 2001

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Fred Elsis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 8 Mar 2001 04:56:57 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (1 lines)
Ken Fong wrote:



> Dear Technetters,

> Is MIL-P-13949 already obsolete and replaced by MIL-S-13949? If yes, what's the

> most up-to-date revision of MIL-S-13949? Where to find an official check of this

> ? Pls advise. Thx.

>

> Ken

>

> ---------------------------------------------------------------------------------

> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d

> To unsubscribe, send a message to [log in to unmask] with following text in

> the BODY (NOT the subject field): SIGNOFF Technet

> To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL

> Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives

> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional

> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315

> ---------------------------------------------------------------------------------



Ken,

    IPC-4101 replaces MIL-S-13949 for rigid & multilayer boards. IPC-4104 is used for HDI &

microvia materials.



Fred Elsis


ATOM RSS1 RSS2