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Reply To: | TechNet E-Mail Forum. |
Date: | Thu, 29 Mar 2001 16:39:54 +1000 |
Content-Type: | text/plain |
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Hello TechNetters,
Has anyone come across the practice of using oval (elongated) pads for BGAs
to help the X-ray inspection of the solder joints?
The claim is that, in a vertical view, you can then see past the ball and
examine the solder fillet on the elongated section of the pad.
regards,
Phil.
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