Subject: | |
From: | |
Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 27 Mar 2001 09:39:54 +0800 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Very poor, as it won't wet or flow much or at all, so any joint formed will
be physically weak.
Can I ask why a fair child like yourself wants to do this?
Rgds
Pete Duncan
Asst Principal Engineer
ST Aerospace
Jonathan A Noquil <[log in to unmask]>@IPC.ORG> on
03/27/2001 09:10:31 AM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
to [log in to unmask]
Sent by: TechNet <[log in to unmask]>
To: [log in to unmask]
cc:
Subject: [TN] Reliability of Solders
Hi Techies
I would like to know what reliability would i expect
if soldering a component using a solder alloy
not melting it to its liquidus or over its liquidus temperature.
Any experience on this?
Thanks and more power.
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET
Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases >
E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for
additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
---------------------------------------------------------------------------------
---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt delivery of Technet send the following message: SET Technet NOMAIL
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------
|
|
|