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Thu, 1 Mar 2001 10:15:50 -0600 |
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hi Ingemar,
I'm interested to hear about this too. adhesive to backside is for die
attach? if so, wont it cause problems when singulating?
Hann
"Ingemar Hernefjord (EMW)" <[log in to unmask]> on
03/01/2001 08:58:48 AM
Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond
to "Ingemar Hernefjord (EMW)" <[log in to unmask]>
To: [log in to unmask]
cc: (bcc: Hann Pang/US-Corporate/3M/US)
Subject: [TN] wafer question
Hi,
was speaking with someone here a year ago about applying adhesives directly
on wafer backsides. Who were You? Not many asking such questions and I
have lost this person's last mails. I remember that guy got few or no
answers at all here.
Ingemar Hernefjord
Ericsson Microwave Systems
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