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Wed, 21 Mar 2001 10:12:46 -0500 |
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Hello Oh Wise Ones, (and hello to the others TechNetters too)
We need to put some thermally conductive adhesive under a component. There
is a hole through the boards to allow some material to flow through, but the
adhesive must NOT be electrically conductive. We've tried the Output 384 by
Loctite, but it hardens too fast and doesn't flow enough.
For technical reasons, we cannot apply the adhesive before the boards is
assembled.
Any ideas would be welcome.
Thanks,
Alain Savard, B.Sc.
Chemical Process Analyst
CAE Montreal
e-mail: [log in to unmask]
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