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March 2001

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Earl Moon <[log in to unmask]>
Date:
Tue, 20 Mar 2001 10:38:50 +0200
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"TechNet E-Mail Forum." <[log in to unmask]>, Brian Ellis <[log in to unmask]>
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Brian Ellis <[log in to unmask]>
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Earl

See below

Earl Moon wrote:
>
> Thanks Brian,
>
> You always come through but for the free viewer stuff. However, a kind
> person from Valor, reminding me no noses need be involved, put me onto
> alternatives.
>
> I'm now the proud user of Valor's free viewer. Well, I'm not yet a user
> because of my computer's unwillingness to reboot after installation. Me an
> computers, damn things. Must be my diagonal approach to it all.
>
> As far as the gold goes, hell immersion or electrolytic, it don't look good
> either way. The exciting thing is we'll be at this forever - searching for
> the perfect coating/plating, or whatever makes solderability a good thing
> like when hot oil fused tin/lead plated holes worked so well.

I agree but, hell, it's a filthy process :-( Also, it gives domed pads,
fine for PTH but not for SMD. :-(

What's wrong with going back to 10 um pure tin pattern plating? It's
flat, preserves solderability for at least 6 months, it's reasonably
inexpensive, the process is easy to control, it won't flow under the
solder mask (wrinkling) provided that you know how to control the
soldering process (OK, no good for lead-free, for this reason), good
compatibility with soldering chemistry of all types, no embrittling, no
tricky and potentially carcinogenic nickel, cosmetically good,
compatible with ammoniacal etchants, won't whisker under good solder
masks nor on soldered pads etc. ??????????????????

Best regards

Brian
>
> Enjoy,
>
> Earl
>
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